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Xiner DIP25 is fully compatible with an imported brand Super Mini series IPM, which directly uses plastic to make the interface cost-effective. The package current specification is complete, which is convenient for the design of customer serialized products. At present, the product has been widely used in servo drives, inverters, elevator doors, inverter air conditioners and other markets.

DIP25 IPM Features and Benefits

• Simple application, fully compatible with imported brands, direct replacement, saving R&D investment;

• Using plastic as a thermal interface to improve cost performance and insulation voltage; and better temperature rise characteristics;
  - IGBT chip margin is larger, core product IGBT wafer is 15% larger than competing products.
  - The lead frame is thicker and has a copper thickness of 0.5 mm, which is 20% higher than competing products.
  - Use a larger tonnage molding machine to improve the flatness of the contact surface.

• HVIC with built-in SOI process, perfect protection function;
  -Using Infineon's driver ICs, it represents the most advanced driver control level in the industry.
  - With dead zone control, and the short circuit protection, the colleague turns off 6 IGBTs, which is safe.

• Complete test data, mature market application;
  - In addition to wafer flow and package testing, the core can perform a full inspection of each manufactured product to ensure product quality.
  - High short-circuit tolerance, each passed the 10uS short-circuit test (400V/15V/150°C).

• Complete product range, easy for customers to expand the power segment;
  - The package includes four products, 6A, 15A, 24A and 35A, which are easy for customers to choose.
  The -35A product uses the DBC process to further reduce thermal resistance.